PSI - Issue 65

A.M. Kazakov et al. / Procedia Structural Integrity 65 (2024) 114–120 Kazakov A.M., Korznikova G.F., Korznikova E.A. / Structural Integrity Procedia 00 (2024) 000–000

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its thermal conductivity by ensuring a homogeneous distribution of graphene platelets. Overall, each method has its advantages and challenges, affecting the final properties of the composite. The choice of fabrication method depends on the desired application, scale of production, and specific property requirements of the composite.

3. Conclusions

Copper-graphene composites represent a promising solution for the thermal management challenges in modern technology. The advancements in material engineering, particularly in optimizing graphene content, improving interfacial bonding, and refining fabrication methods, have significantly enhanced the thermal conductivity of these composites. As ongoing research continues to explore scalable and cost-effective production methods, copper graphene composites are poised to play a critical role in next-generation electronic devices, high-temperature motors, and other thermal management applications. Future studies focused on modeling thermal transport mechanisms will further unlock the potential of this innovative material.

Acknowledgements

The work was supported by the Russian Science Foundation (Grant No. 23-29-00863).

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