PSI - Issue 65

A.M. Kazakov et al. / Procedia Structural Integrity 65 (2024) 114–120 Kazakov A.M., Korznikova G.F., Korznikova E.A./ Structural Integrity Procedia 00 (2024) 000–000

118

5

The first group consists of ball milling (Cui et al., 2014), hot press sintering (Khobragade et al., 2017) and spark plasma sintering (SPS) (Zhang et al., 2016). Such composite production methods collectively offer a powerful combination for enhancing material properties. Ball milling ensures fine particle size and uniform mixing, creating a strong foundation for composite production. Hot press sintering and SPS then use high pressure and heat to densify materials, with SPS providing the added benefit of rapid heating and precise control, resulting in composites with superior mechanical strength, thermal conductivity, and controlled microstructures. Together, these methods enable the production of high-performance, dense materials with enhanced electrical and thermal properties. Figure 4 represents a variant to prepare copper-graphene composite using these methods, Lu et al. (2022).

Fig. 4. The process of preparation copper-graphene composite (Lu et al., 2022).

Electrochemical methods include electrochemical deposition and pulse reverse electrodeposition (PRED). These methods are cost-effective and mostly used to fabricate composite coatings or foils with improved operational properties. Figure 5 illustrates the scheme of these processes, Pavithra et al. (2014).

Fig. 5. The scheme of direct and reverse electrodeposition (Pavithra et al., 2014).

CVD is a versatile method for depositing thin films and coatings through gas-phase chemical reactions on heated substrates, Bae et al. (2010). It is widely utilized for producing high-quality, uniform films, such as graphene, carbon nanotubes, and various semiconductors. CVD allows precise control over film thickness, purity, and composition, making it ideal for applications in microelectronics, photovoltaics, and advanced coatings. However, it often requires high temperatures and specialized equipment, and scaling up can be challenging for large-area applications. Advanced techniques like electroless plating, Jiang et al. (2017), molecular-level mixing, Chen et al. (2016), high pressure torsion (HPT), Korznikova et al. (2020), have been instrumental in optimizing the graphene dispersion within the copper matrix. These methods not only improve the structural integrity of the composite but also enhance