PSI - Issue 83

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ScienceDirect

Procedia Structural Integrity 83 (2026) 41–46

© 2026 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of the scientific committee of the ESIAM26 organizers Keywords: Finite element analysis; Mixed-mode; Stress intensity factor; T-stress; Semicircular bend specimen Abstract Semicircular bend (SCB) specimen is most feasible test sample for assessing mixed mode fracture toughness in brittle and quasi brittle materials. This study focused on numerical analysis of SCB specimens with edge cracks under three-point bending. The simulation approach used Polylactic Acid (PLA) material properties to determine the stress intensity factors (K I , K II ) and T -stress for various mode mixities. To identify the crack angle for experiment at which pure mode-II loading conditions exist, particular analysis are performed. A ratio of 0.5 is taken into account for the ratio of crack length to radius (a/R) and the span length to radius (S/R) in order to execute finite element analysis. Result suggested that T -stress is grow with increasing crack angles and having good agreement with pertinent findings from the literature. 1. Introduction Fracture mechanics is a vital technique that is mostly used to assess the viability of defective parts based on a range of factors Ayatollahi et al. (2006). Both computationally and experimentally, several researchers have investigated the fracture outcomes for a variety of brittle or quasi-brittle materials, such as ceramic, rocks, concrete, polymethylmethacrylate (PMMA), nanocomposites, etc., under a range of loading conditions and specimen geometries Ayatollahi et al.(2007),(2008), (2010), Fayed (2018) and Jabiulla et al. (2024). The fourth European Conference on the Structural Integrity of Additively Manufactured Materials (ESIAM26) Mixed mode (I/II) fracture analysis of PLA using SCB Specimen- A numerical approach Ritesh M. Patel a* , Chaitanya K. Desai b a C. K. Pithawala College of Engineering and Technology,Surat-395007 Gujarat, India b C. K. Pithawala College of Engineering and Technology,Surat-395007 Gujarat, India

* Corresponding author. E-mail address: ritesh.m.patel@ckpcet.ac.in

2452-3216 © 2026 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of the scientific committee of the ESIAM26 organizers 10.1016/j.prostr.2026.07.005