PSI - Issue 47

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Rachid Bensaada et al. / Procedia Structural Integrity 47 (2023) 503–512 R. Bensaada et al. / Structural Integrity Procedia 00 (2019) 000 – 000

Fig. 11. Failure envelope of Tensylon®

4. Conclusion The aim of this work was to characterize the interply strength of Tensylon®. To do so, the choice of the couple (adhesive, substrate) was challenging given the weak surface energy of Tensylon® and its sensitivity to temperature. The association (ABS, Permabond TA 4610) as substrate and adhesive respectively was found to be efficient to allow the ARCAN tests where other material association failed. The acrylic Permabond TA 4610 adhesive was characterized using Arcan device at 0° (Tensile loading). A quasi brittle response is observed, and this latter is well reproduced using a bi-linear cohesive zone model through 3D finite element simulation. Subsequently, Tensylon® is tested through Arcan device following four angles to vary the stress state (tensile, shear, tensile-shear). The results obtained were used to determine the failure envelope of the Tensylon®. This envelope gives an overall information concerning the stress threshold of the material in terms of out-of-plane strength. As future work, numerical validation of Tensylon® delamination under Arcan test is in progress. Coated Tensylon® will be studied to assess the interface strength and overall, out-of-plane strength of the assembly. Acknowledgements Authors want to acknowledge Agence de l ’ Innovation de Défense of the Direction Générale de l’Armement DGA for the grant n° AID 2020 65 0056. Authors also want to thank Dr. Thomas Bonnemains from Université de Bretagne Occidentale for his precious help for the water jet cutting and Prof. Julien Jumel from ENSTA Bretagne for fruitful discussions and precious help for Pull-Off tests.