Issue 15

K. Vogel et

alii, Frattura ed

Integrità Struttu

rale, 15 (2011)

21-28; DOI: 10

.3221/IGF-ESIS.

15.03

100

Si-Si geom Si-Si geom

etry 1 etry 2

90

stress intensity coefficient Y(  ) 60 70 80

MIN

50

0.0

0.1

0

r .2 0.3 elative crack

0.4 length 

0.5

0.6

Figure 7 : E

stimation of

dimensionless

stress intensit

y coefficient a

s a function of

geometry.

6

non-activate oxygen acti nitrogen act

d vated ivated

5

4

3

2

maximum force [N]

1

0

50 40

0

100 ealing tempe

1

50

Anne

aling [°C]

ann

rature [°C]

Figure 8 : M

aximum forc

es for differen

t pre and heat

treatments.

C O

NCLUSION S

act of b T

he comp the influ treatmen

liance meth ence of the s t and the b during the m gth.

od is a suitab pecimen geo onding temp anufacturin

le approach metry is con erature itself g process lea

the fracture t g the calcula ct the measu antly reduced

oughness of tion of stress red maximu annealing t

direct bond intensity coe m force. Th emperatures

ed wafers. W fficient, the e use of pla without any

hile pre sma loss

to estimate sidered durin directly affe ds to signific

ivated wafers onding stren

27