PSI - Issue 25

Victor Rizov / Procedia Structural Integrity 25 (2020) 88–100 Author name / Structural Integrity Procedia 00 (2019) 000 – 000

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Sci Technol 59, 609-619. Guadette, F.G., Giannapoulos, A.E., Suresh, S., 2001. Interfacial cracks in layered materials subjected to a uniform temperature change. Int. J. Fract. 28, 5620-5629. Jiao, J., Gurumurthy, G.K., Kramer, E.J., Sha, Y., Hui, C.Y., Borgesen, P., 1998. Measurement of interfacial fracture toughness under combined mechanical and thermal stress. J. Electron Packag 120, 325-349. Kevin O’Brien, T., 1998. Interlaminar fracture toug hness: the long and winding road to standardization. Composites Part B 29B, 57-62. Narin, J.A., 2006. On the calculation of energy release rates for cracked laminates with residual stresses. International Journal of Fracture 139, 267-293. Rizov, V.I., 2017. Analysis of longitudinal cracked two-dimensional functionally graded beams exhibiting material non-linearity. Frattura ed Integrità Strutturale 41, 498 -510. Rizov, V.I., 2018. Analysis of cylindrical delamination cracks in multilayered functionally graded non-linear elastic circular shafts under combined loads. Frattura ed Integrità Strutturale 4 6, 158-177. Rizov, V.I., 2019. Influence of material inhomogeneity and non-linear mechanical behavior of the material on delamination in multilayered beams. Frattura ed Integrità Strutturale 4 7, 468-481. Suo Guo, Dillard, D., Narin, J., 2005. Effects of residual stress on the energy release rate of wedge and DCB test specimens. International Journal of Adhesion and Adhesives 26, 285-294. Szekrenyes, A., 2010. Fracture analysis in the modified split-cantilever beam using the classical theories of strength of materials. Journal of Physics: Conference Series 240, 012030. Szekrenyes, A, Vicente, W.M., 2012. Interlaminar fracture analysis in the GII-GIII plane using prestressed transparent composite beams. Composites Part A: Applied Science and Manufacturing 43, 95-103. Yeung, D.T.S., Lam, D.C.C., Yuen, M.M.F., 2000. Specimen design for mixed mode interfacial fracture properties measurement in electronic packages. J. Electr. Packag. 122, 67-72. Yokozeki, T., Ogasawara, T., Aoki, T., 2007. Correction method for evaluation of interfacial fracture toughness of DCB, ENF and MMB specimens with residual thermal stresses. Composites Science and Technology 68, 760-767.