PSI - Issue 25

Available online at www.sciencedirect.com Structural Integrity Procedia 00 (2019) 000–000 Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2019) 000–000 Available online at www.sciencedirect.com ScienceDirect

www.elsevier.com/locate/procedia www.elsevier.com/locate/procedia

ScienceDirect

Procedia Structural Integrity 25 (2020) 348–354

© 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the VCSI1 organizers features being typical of intergranular fracture. © 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the VCSI1 organizers Abstract In order to assess the mechanical properties of Al-Mg-Si alloys at elevated temperatures, the tensile properties of a 1.4 mm diameter filler wire of the AA6082 type being used in the HYB process have been investigated at five different temperatures from room temperature and up to 500 °C. The measured engineering stress-strain curves serve as a basis for the analysis. In addition, selected fracture surfaces have been analyzed using scanning electron microscopy to reveal the fracture mechanism. It is shown that the tensile strength decreases steadily with increasing temperatures. Also, the ductility is seen to be sensitive to changes in the temperature. At high temperatures creep rupture appears to be the predominant fracture mechanism. This type of failure is associated with negligible necking and shows all features being typical of intergranular fracture. © 2020 The Authors. Published by Elsevier B.V. This is an open access article under C BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) 1st Virtual Conference on Structural Integrity - VCSI1 High temperature tensile properties of AA6082 filler wire used for solid-state joining Francesco Leoni* a , Øystein Grong a,b , Lise Sandnes a , Filippo Berto a a Faculty of Engineering, NTNU, Richard Birkelands vei 2B, Trondheim 7491, Norway b HyBond AS, NAPIC, Richard Birkelands vei 2b, Trondeim7491, Norway Abstract In order to assess the mechanical properties of Al-Mg-Si alloys at elevated temperatures, the tensile properties of a 1.4 mm diameter filler wire of the AA6082 type being used in the HYB process have been investigated at five different temperatures from room temperature and up to 500 °C. The measured engineering stress-strain curves serve as a basis for the analysis. In addition, selected fracture surfaces have been analyzed using scanning electron microscopy to reveal the fracture mechanism. It is shown that the tensile strength decreases steadily with increasing temperatures. Also, the ductility is seen to be sensitive to changes in the temperature. At high temperatures creep rupture appears to be the predominant fracture mechanism. This type of failure is associated with negligible necking and shows all 1st Virtual Conference on Structural Integrity - VCSI1 High temperature tensile properties of AA6082 filler wire used for solid-state joining Francesco Leoni* a , Øystein Grong a,b , Lise Sandnes a , Filippo Berto a a Faculty of E gineering, NTNU, Richard Birkelands vei 2B, Trondheim 7491, Norway b HyBond AS, NAPIC, Richard Birkelands vei 2b, Trondeim7491, Norway

Peer-review under responsibility of the VCSI1 organizers

Keywords: Aluminum, High temperature, Tensile test Keywords: Aluminum, High temperature, Tensile test

* Corresponding author. Tel.: +393473335042. E-mail address: francesco.leoni@ntnu.no * Correspon ing author. Tel : +393473335042. E-mail address: francesco.leoni@ntnu.no

2452-3216 © 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the VCSI1 organizers 2452-3216 © 2020 The Authors. Published by Elsevier B.V. This is an ope acces article under C BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)

Peer-review under responsibility of the VCSI1 organizers

2452-3216 © 2020 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the VCSI1 organizers 10.1016/j.prostr.2020.04.039