PSI - Issue 17

Pedro J. Sousa et al. / Procedia Structural Integrity 17 (2019) 835–842 Author name / Structural Integrity Procedia 00 (2019) 000 – 000

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(a) Visualization of the obtained displacements for the inner region in the XZ plane

(b) Visualization of the obtained displacements for the outer region in the XZ plane

(d) Visualization of the obtained displacements for the outer region in the YZ plane

(c) Visualization of the obtained displacements for the inner region in the YZ plane

(f) Visualization of the obtained displacements for the outer region in the XY plane

(e) Visualization of the obtained displacements for the inner region in the XY plane

Fig. 9. Representation of the obtained specimen displacements when loaded up to 40°C, in the three orthogonal planes In order to define the rotation between the inner and outer regions, the same best-fit method was once again applied, after the first correction. In this case, the inner region was the considered one, and compared to a plane. The obtained results are presented in Fig. 10, where it is possible to see the orientation of the measured rotation angle, around which the inner region rotated 0.0046 degrees.

Axis direction: u⃗ = [ 0 0 . . 8 5 2 6 3 7 5 4 -2.001×10 -6 ]

Fig. 10. Rotation axis of the motion between the inner and outer regions

5. Conclusions

This work presents a methodology for the measurement of sub-micrometer displacements in PCB designs using 3D Electronic Speckle Pattern Interferometry. It was possible to obtain real measurements using this methodology and compare the behavior of the two considered regions of interest.