PSI - Issue 17

Available online at www.sciencedirect.com Structural Int grity Procedia 00 (2019) 000 – 000 Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2019) 000 – 000 Available online at www.sciencedirect.com ScienceDirect

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Procedia Structural Integrity 17 (2019) 835–842

ICSI 2019 The 3rd International Conference on Structural Integrity Application of 3D electronic speckle pattern interferometry for the analysis of thermal response in printed circuit boards Pedro J. Sousa a,b,* , Fernando Carneiro b , Nuno Viriato Ramos b , Francisco Barros b , Mário A. P. Vaz a , Paulo J. Tavares b , Pedro M. G. P. Moreira b a Faculty of Engineering, University of Porto, Rua Dr. Roberto Frias, s/n, 4200-465 Porto, Portugal b INEGI – Institute of Science and Innovation in Mechanical and Industrial Engineering, Rua Dr. Roberto Frias, 400, 4200-465 Porto, Portugal ICSI 2019 The 3rd International Conference on Structural Integrity Application of 3D electronic speckle pattern interferometry for the analysis of thermal response in printed circuit boards Pedro J. Sousa a,b,* , Fernando Carneiro b , Nuno Viriato Ramos b , Francisco Barros b , Mário A. P. Vaz a , Paulo J. Tavares b , Pedro M. G. P. Moreira b a Faculty of E gineeri g, University of Porto, Rua Dr. Roberto Frias, s/n, 4200-465 Porto Portugal b INEGI – Institute of Science and Innovation in Mechanical and Industrial Engineering, Rua Dr. Roberto Frias, 400, 4200-465 Porto, Portugal The present work reports the development of a method for measurement of sub-micrometer displacements due to the thermal response of printed circuit boards. The developed system employs Electronic Speckle Pattern Interferometry in three dimensions, obtaining three orthogonal displacements of the specimen’s surface from the resulting phase maps. Afterwards, the displacements are corrected, removing the rigid rotation of the physical support and the relative rotation between the two regions of interest is calculated. This method provides a very high-resolution displacement measurement tool, which is very important, for example, in the design phase of outdoor surveillance cameras to optimize image quality. The present work reports the development of a method for measurement of sub-micrometer displacements due to the thermal response of rinted circuit boards. The developed system e ploys Ele tronic Speckle Pattern Interferometry in three dimensions, obtaining three orthogonal displacements of the specimen’s surface from the resulting phase maps. Afterwards, the displacements are corrected, removing the rigid rotation of the physical support and the relative rotation betw en the two regions of interest is calculat d. T is method provides a very high-resolution displacement measurement tool, which is very important, for example, in the design phase of outdoor surveillance cameras to optimize image quality. Abstract Abstract

© 2019 The Authors. Published by Elsevier B.V. Peer-review under responsibility of the ICSI 2019 organizers. © 2019 The Authors. Published by Elsevier B.V. Peer-review under responsibility of the ICSI 2019 organizers. © 2019 The Authors. Published by Elsevier B.V. Peer-review under responsibility of the ICSI 2019 organizers.

Keywords: Electronic Speckle Pattern Interferometry, Thermal response, PCB mechanical analysis, Displacement measurement Keywords: Electronic Speckle Pattern Interferometry, Thermal response, PCB mechanical analysis, Displacement measurement

1. Introduction 1. Introduction

Even the slightest displacements in support PCBs of outdoor cameras can have a significant impact on the quality of the information generated by the cameras of a distant object. These displacements usually arise due to temperature changes in the surrounding environment and cause errors that may exceed the allowable range for the corrections Even the slightest displacements in support PCBs of outdoor cameras can have a significant impact on the quality of the information generated by the cameras of a distant object. These displacements usually arise due to temperature changes in the surrounding environment and cause errors that may exceed the allowable range for the corrections

* Corresponding author. E-mail address: ppsousa@fe.up.pt * Correspon ing author. E-mail address: ppsousa@fe.up.pt

2452-3216 © 2019 The Authors. Published by Elsevier B.V. Peer-review under responsibility of the ICSI 2019 organizers. 2452-3216 © 2019 The Authors. Published by Elsevier B.V. Peer-review under responsibility of the ICSI 2019 organizers.

2452-3216  2019 The Authors. Published by Elsevier B.V. Peer-review under responsibility of the ICSI 2019 organizers. 10.1016/j.prostr.2019.08.111