PSI - Issue 39

O.N. Belova et al. / Procedia Structural Integrity 39 (2022) 770–785 Author name / Structural Integrity Procedia 00 (2021) 000–000

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Oiu, P.,Yue, Z., Yang, R., 2021. Experimental study on mode-I and mixed-mode crack propagation under tangentially incident P waves, S waves, S waves and reflected waves in blasts. Engineering Fracture Mechanics 247, 107664. Ramesh, K., 2021. Developments in Photoelasticity. A renaissance. IOP. Ramesh, K., Sasikumar, S., 2020. Digital photoelasticity: Recent developments and diverse applications. Optic and Laser in Engineering 106186. Ramesh, K., 2015. Digital Photoelasticity: Advancements and Applications. Optical Engineering 54(8), 081201. Ramesh, K., Gupta, S., Kelkar, A.A., 1997. Evaluation of stress field parameters in fracture mechanics by photoelasticity – revisited. Engineering Fracture Mechanics 56, 25-45. Ramesh, K., 2000. Digital photoelasticity. Springer. Stepanova, L.V., 2021, Experimental determination and finite element analysis of coefficients of the multi-parameter Williams series expansion in the vicinity of the crack tip in linear elastic materials. Part II. PNRPU Mechanics 1, 72-85. Stepanova, L.V., 2020a, Experimental determination and finite element analysis of coefficients of the multi-parameter Williams series expansion in the vicinity of the crack tip in linear elastic materials. Part I. PNRPU Mechanics 4, 237-249. Stepanova, L.V., 2020b. The algorithm for the determination of the Williams asymptotic expansion coefficients for notched semidiscs using the photoelasticity method and finite element method. AIP Conference Proceedings 2216, 020013. Stepanova, L.V., Dolgich, V.S., 2021. Assessment of the SIF, T-stress and higher-order coefficient values of the cracked specimens with two interacting cracks or notches un mixed mode loadings by digital photoelasticity method. AIP Conference Proceedings 2371, 020013. Stepanova, L.V., Dolgikh, V.S., 2018. Interference-optical methods in mechanics for the multi-parameter description of the stress fields in the vicinity of the crack tip. Journal of Physics: Conference Series 1096, 012117. Stepanova, L.V., Dolgikh, V.S., Turkova, V.A, 2017. Digital photoelasticity for calculating coefficients of the Williams series expansion in plate with two collinear cracks under mixed mode loading. CEUR Workshop Proceedings 1904, 200-208. Stepanova, L.V., Roslyakov, P.S., 2016. Complete Williams asymptotic expansion of the stress field near the crack tip: analytical solutions, interference-optic methods and numerical experiments. AIP Conference 1785, 030029. Su, F., Zhang, B., Li, T., 2021. High speed stress measurement technique based on photoelastic modulator (PEM) and Galvano-scanner. Optics and Lasers 136, 106306. Tabanyukhova, M.V., 2020. Photoelastic analysis of the stressed state of a flat element with geometrical stress concentrators (cutout and cuts). Key Engineering Materials 827, 330-335. Vivekanandan, A., Ramesh, K., 2019. Study of interaction effects of asymmetric cracks under biaxial loading using digital photoelasticity. Theoretical and Applied Fracture Mechanics 99, 104-117. Yang, B., Wei, Z., Diaz, F.A., Liao, Z., James, M.N., 2021. New algorithm for optimized fitting of DIC data to crack tip plastic zone using the CJP model. Theoretical and applied Fracture Mechanics 113, 102950.