PSI - Issue 43

Available online at www.sciencedirect.com Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2022) 000 – 000 Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2022) 000 – 000

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ScienceDirect

Procedia Structural Integrity 43 (2023) 23–28

© 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under the responsibility of MSMF10 organizers. © 20 23 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under the responsibility of MSMF10 organizers. Abstract In the field of modern el ctronic, medical nd aero-space industry here has been an increasi g demand on the nvestigation and devel pment of n w aterials and their usage as thin films and coatings. To ensure a proper and long-life r liability of the device composed of several micro- and n no-scale thin layers, not only the reliability of used mat rials has be engineered, but also e interface stability between th layers must be en ured. Modern thin f lm applications use the combinati n of metallic conductive thin films o compli nt substr tes or hard coa ings, connecting two, highly dissimilar materials. Therefore, in order to correct ssess he interface adhe ion and fractur crit ria, the elastic misma ch between the hin film and substrate must be properly accounted for. A widely used method to m asure the adh sion betw en thin film and substrate is the buckling-induce delam nati n by Hutchinson and Suo (1992) where the adhesion energy of the thin film i evaluated as a function of the mode-mixity (for mixed-mod I+II) angle. However, a common practice in such measurements is t disreg rd the elastic mis atch of film and substrat . Re nt res arch sh wed that the elastic mismatch has significant impact on the value o the mode-mixity ngl . Since the depen ence of the adhesion energy on the ratio b tw en modes I and II is used for the in erface fr cture criteria, the errors introd ced by disregarding the elastic mismatch influence ay lead t errors in estimation of the ritical crack driving forc . In this tudy, we apply our model of the influ nce of the elastic mismatch on sev ral f acture criteria in combination with experim tal measurements of three film-substrate systems. Appl cation f a mor precise approach with use of the elastic mismatch influ nc show change in obtained mode I critical crack driving force. Therefor , the pres nted w rk highlight the need for precise assessment of the elastic mismatch influence on the mode-mixity when measuring the adhesion of thin films. © 20 23 The Authors. Published by Elsevier B.V. This is an ope access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under the responsibility of MSMF10 organizers. 10th International Conference on Materials Structure and Micromechanics of Fracture Elastic Mismatch Influence on Modes I and II Ratio during Buckling-induced Delamination Stanislav Žák a ,* and Alice Lassnig a a Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstraβe 12, 8700 Leoben, Austria Abstract In the field of modern electronic, medical and aero-space industry there has been an increasing demand on the investigation and development of new materials and their usage as thin films and coatings. To ensure a proper and long-life reliability of the device composed of several micro- and nano-scale thin layers, not only the reliability of used materials has to be engineered, but also the interface stability between the layers must be ensured. Modern thin film applications use the combination of metallic conductive thin films on compliant substrates or hard coatings, connecting two, highly dissimilar materials. Therefore, in order to correctly assess the interface adhesion and fracture criteria, the elastic mismatch between the thin film and substrate must be properly accounted for. A widely used method to measure the adhesion between thin film and substrate is the buckling-induced delamination by Hutchinson and Suo (1992) where the adhesion energy of the thin film is evaluated as a function of the mode-mixity (for mixed-mode I+II) angle. However, a common practice in such measurements is to disregard the elastic mismatch of film and substrate. Recent research showed that the elastic mismatch has significant impact on the value of the mode-mixity angle. Since the dependence of the adhesion energy on the ratio between modes I and II is used for the interface fracture criteria, the errors introduced by disregarding the elastic mismatch influence may lead to errors in estimation of the critical crack driving force. In this study, we apply our model of the influence of the elastic mismatch on several fracture criteria in combination with experimental measurements of three film-substrate systems. Application of a more precise approach with use of the elastic mismatch influence show change in obtained mode I critical crack driving force. Therefore, the presented work highlights the need for precise assessment of the elastic mismatch influence on the mode-mixity when measuring the adhesion of thin films. 10th International Conference on Materials Structure and Micromechanics of Fracture Elastic Mismatch Influence on Modes I and II Ratio during Buckling-induced Delamination Stanislav Žák a ,* and Alice Lassnig a a Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstraβe 12, 8700 Leoben, Austria

Keywords: elastic mismatch; finite element modelling; fracture criteria; mode-mixity; thin film delamination Keywords: elastic mismatch; finite element modelling; fracture criteria; mode-mixity; thin film delamination

* Corresponding author. Tel.: +420-603-799-811. E-mail address: stanislav.zak@oeaw.ac.at * Correspon ing author. Tel.: +420-603-799-811. E-mail address: stanislav.zak@oeaw.ac.at

2452-3216 © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under the responsibility of MSMF10 organizers. 2452-3216 © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under the responsibility of MSMF10 organizers.

2452-3216 © 2023 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under the responsibility of MSMF10 organizers. 10.1016/j.prostr.2022.12.229