PSI - Issue 41

Andrew Premchander et al. / Procedia Structural Integrity 41 (2022) 305–316 Andrew Premchander/ Structural Integrity Procedia 00 (2019) 000–000

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4.1. Case 1 –Without considering the microstructure In most cases, structural analysis is carried out at macroscopic level and in general the grain structures are neglected as they are too small when compared to the actual dimension of the material. Figure 5 shows the simulation results of the crack propagation in the plate shown in figure 4, without considering the microstructure.

Figure 5: Crack propagation in polycrystalline silicon with GBC 1.0, total time = 2.4 μs and time step 2 ns. Average grain size is 333 μm, with horizon diameter 50 μm

From the observation in figure 5, the crack propagation has a transgranular pattern, where the crack propagates through the grains.