PSI - Issue 37

ScienceDirect Structural Integrity Procedia 00 (2019) 000 – 000 Structural Integrity Procedia 00 (2019) 000 – 000 Available online at www.sciencedirect.com Available online at www.sciencedirect.com ScienceDirect Available online at www.sciencedirect.com ScienceDirect

www.elsevier.com/locate/procedia www.elsevier.com/locate/procedia

Procedia Structural Integrity 37 (2022) 131–138

© 2022 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of Pedro Miguel Guimaraes Pires Moreira Abstract Stretchable polymers such as polyethylene terephthalate, polyether sulfone etc. are widely used as substrates for flexible electronics. Though these materials are clinically approved and safe to employ for in-vitro applications, still, using collagen as an alternative would be beneficial thanks to its biocompatibility, biodegradability, non-toxicity and flexibility. Recently, some researchers were successful in fabricating sensors with collagen substrates; however, the softer collagen base attached to the stiffer metallic layers might create a mismatch in the interfacial properties and affect the device’s performance. Therefore, it is essential to investigate the mechanical behaviour of collagen-metallic interfaces. It was observed that at lower strain levels (1.25%) the interfacial delamination between the collagen-and metallic layers is negligible while at higher strain (5%), a considerable delamination was noticed. The effect of environment should also be considered as the stress generated for both metallic layers and collagen substrates differed by two orders of magnitude compared to dry ones. © 2022 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Abstract Stretchable polymers such as polyethylene terephthalate, polyether sulfone etc. are widely used as substrates for flexible el ctronics. Though these materials are clinically a proved and safe to employ for in-vitro pplications, still, using col agen as an alternativ would be ben fi al thanks to its biocompatibility, biodegradability, non-toxicity and flexibility. Recently, some res archers wer successful in fabricating sensors with c lla en subs rates; h wever, the softer collag n base attached to t e stiff metallic layers might creat a mismatch in the interfacial pr perti s and af ect the device’s performance. Therefore, it is essential to investigate the ech nical behaviour of collagen-met llic int rfac s. It was observed that at lower strain lev ls (1.25%) the int rfacial delamination between the collag n-and m tallic layers is negligible while at higher strain (5%), a cons derable delamination was noticed. The effect of environment should also e cons dered as the stress generated f r both metallic layers a d collagen substrates differed by two order of magnitude compa to dry on . © 2022 The Authors. Publish d by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review u der re ponsibility of P dro Miguel Guimara s Pires Moreir Keywords: Collagen, flexible electronics, stress generation, interfacial delamination 1. Introduction Recent advances in the flexible electronics drew attention of several researchers to use collagen as a substrates in flexible electro i s (Mor no t a ., 2015; Le et al., 2019) ha ks to their biocompatibility, bi de rad bility, flexibil ty ICSI 2021 The 4th International Conference on Structural Integrity Interfacial damage in flexible electronics with collagen substrate: effect of environmental conditions Shirsha Bose a , Simin Li a , Elisa Mele b , Vadim V. Silberschmidt a,c* a Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire LE11 3TU, UK. b Department of Materials, Loughborough University, Loughborough, Leicestershire LE11 3TU, UK. c Laboratory of Mechanics of Biocompatible Materials and Devices, Perm National Research Polytechnic University, Perm 614990, Russia ICSI 2021 The 4th International Conference on Structural Integrity Interfacial damage in flexible electronics with collagen substrate: effect of environmental conditions Shirsha Bose a , Simin Li a , Elisa Mele b , Vadim V. Silberschmidt a,c* a Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Loughbo ough, Leicestershire LE11 3TU, UK. b Department of Materials, Loughborough University, Loughborough, Leicestershire LE11 3TU, UK. c Laboratory of Mechanics of Biocompatible Materials and Devices, Perm National Research Polytechnic University, Perm 614990, Rus ia Peer-review under responsibility of Pedro Miguel Guimaraes Pires Moreira Keywords: Collagen, flexible electronics, stress generation, interfacial delamination 1. Introduction Recent advances in the flexible electronics drew attention of several researchers to use collagen as a substrates in flexible electronics (Moreno et al., 2015; Lei et al., 2019) thanks to their biocompatibility, biodegradability, flexibility

2452-3216 © 2022 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of Pedro Miguel Guimaraes Pires Moreira 2452-3216 © 2022 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of Pedro Miguel Guimaraes Pires Moreira

2452-3216 © 2022 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of Pedro Miguel Guimaraes Pires Moreira 10.1016/j.prostr.2022.01.068