PSI - Issue 33

Saki Hayashi et al. / Procedia Structural Integrity 33 (2021) 1162–1172 Hayashi et al / Structural Integrity Procedia 00 (2019) 000 – 000

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Nomenclature temperature [ ℃ ] ph temperature between the preheating passes [ ℃ ] ∞ outside temperature [ ℃ ] W temperature rise due to moving point heat source [ ℃ ] density [g/cm 3 ] specific heat [cal/g ･ ℃ ] time after the heat source passes through the origin ( x=y=z=0 ) [s] ℎ board thickness [cm] P energy of heat source =0.24 η AV [cal/s] thermal conductivity [cal/ ( ℃ ･ cm ･ s)], λ =0.06 ＋ 0.012 HI dissolution speed [cm/s] coordinate of weld line direction moving [cm] thermal diffusivity [cm 2 /s], =0.042+0.016 HI thermal reflection coefficient at board surface=0.90 (SAW), 0.80 (SMAW, GMAW, GTAW) rectangular coordinates of weld line direction [cm] coordinates in thickness direction [cm] η arc thermal efficiency, η =1.0 (SAW), 0.80 (GMAW, GTAW) AE arc energy =60AV/v [J/cm] HI dissolved access heat = η AE [J/cm] A welding current [A] V welding voltage [V] 1 heat dissipation rate of weld surface = 0.0005 cm/s (SAW), = 0.0020 cm/s (SMAW, GMAW, GTAW) heat dissipation rate of the plate surface outside the weld = 0.0020 cm/s

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α thermal diffusion coefficient [cal/(cm 2 ･ s)] quasi quasi-CTOD [mm] stress intensity factor [N/mm 3/2 ] shape parameter y yield stress [MPa] young’s module [MPa] p plastic term correction factor p plastic rotational factor 0 initial notch depth of test specimens [mm] p plastic component of clip gauge [mm] testing machine power length of span in three-point bending test [mm] thickness of test specimens [mm] width of test specimens [mm] fracture probability density function downscaling ratio ( ) thickness correction factor in plastic term p@ =25mm ν Poisson’s ratio ESLL effective slip line length TE temperature Embrittlement Y i cover rate of element i at grain boundary

crack tip deformation correction factor in plastic term

volume diffusivity of element i

D i

boundary thickness

θ