PSI - Issue 24

Available online at www.sciencedirect.com Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2019) 000–000 Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2019) 000–000

www.elsevier.com/locate/procedia www.elsevier.com/locate/procedia

ScienceDirect

Procedia Structural Integrity 24 (2019) 601–611

© 2019 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the AIAS2019 organizers Abstract Adhesively bonded structures are widely used in many engineering fields for new structures and strengthening of existing ones. The failure of these joints are in some cases caused by long-term deformations. In this paper, an in house made experimental setup for investigating the creep behavior of epoxy resin specimens is presented. The test equipment consists of both conventional apparatus and a non-contact optical technique, Digital Image Correlation (DIC). Several tests were performed at different temperatures and the corresponding results were used for creep master curve construction by means of time-temperature superposition principle (TTSP). © 2019 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the AIAS2019 organizers Abstract Adhesively bonded structures are widely used in many engineering fields for new structures and strengthening of existing ones. The failure of these joints are in some cases caused by long-term deformations. In this paper, an in house made experimental setup for investigating the creep behavior of epoxy resin speci ens is presented. The test equipment consists of both conventional apparatus and a non-contact ptical technique, Digital Image Correlation (DIC). Several tests were performed at different temperatures and the corresponding results were used for creep master curve construction by means of time-temperature superposition principle (TTSP). © 2019 The Authors. Published by Elsevier B.V. This is an ope access article under t e CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the AIAS2019 organizers AIAS 2019 International Conference on Stress Analysis Experimental evaluation of the long-term creep deformations of epoxy resin Michele Perrella a *, Valentino Paolo Berardi b , Gabriele Cricrì c , Renato Esposito a a Università degli Studi di Salerno - Dipartimento di Ingegneria Industriale, Via Giovanni Paolo II 132, 84084 Fisciano b Università degli Studi di Salerno - Dipartimento di Ingegneria Civile, Via Giovanni Paolo II 132, 84084 Fisciano c Università degli Studi di Napoli “Federico II” - Dipartimento di Ingegneria Industriale, Piazzale Tecchio 80, 80143 Napoli AIAS 2019 International Conference on Stress Analysis Experimental evaluation of the long-term creep deformations of epoxy resin Michele Perrella a *, Valentino Paolo Berardi b , Gabriele Cricrì c , Renato Esposito a a Università degli Studi i Salerno - Dipartimento di Inge neria Industriale, Via Giovanni Paolo II 132, 84084 Fisciano b Università degli Studi di Salerno - Dipartimento di Ingegneria Civile, Via Giov nni olo II 132, 840 4 Fisciano c Università degli Studi di Napoli “Federico II” - Dipartimento di Ingegneria Industriale, Piazzale Tecchio 80, 80143 Napoli 1. Introduction Structural adhesive bonding has become a widely used joining technique in many engineering fields, also as a consequence of the increasing practice of composite materials. In mechanical engineering applications, bonded composites are typically used for the realization and repair of industrial, aerospace, naval and automotive structural 1. Introduction Structural adhesive bonding has become a widely used joining technique in many engineering fields, also as a consequence of the increasing practice of composite materials. In mechanical engineering applications, bonded composites are typically used for the realization and repair of industrial, aerospace, naval and automotive structural Keywords: Creep; DIC; Bonded joint; Keywords: Creep; DIC; Bonded joint;

* Corresponding author. Tel.: +39-089-964070; fax: +39-089-964037. E-mail address: mperrella@unisa.it * Correspon ing autho . Tel.: +39-089-964070; fax: +39-089-964037. E-mail address: mperrella@unisa.it

2452-3216 © 2019 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the AIAS2019 organizers 2452-3216 © 2019 The Authors. Published by Elsevier B.V. This is an ope acces article under t CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the AIAS2019 organizers

2452-3216 © 2019 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/) Peer-review under responsibility of the AIAS2019 organizers 10.1016/j.prostr.2020.02.053