PSI - Issue 81

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ScienceDirect

Procedia Structural Integrity 81 (2026) 529–535

© 2026 The Authors. Copy from the contract: Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of DMDP 2025 organizers Keywords: CO ₂ laser processing; laser scribing; silicate glass; surface damage; microrelief formation; morphological characterisation. 1. Introduction In industrial applications, the laser processing of brittle silicate materials has primarily relied on thermally controlled crack propagation. This method enables the efficient separation of glass sheets by utilizing controlled temperature gradients and Abstract Dimensional laser processing of brittle materials through layer-by-layer material removal is conducted using the laser scribing technique, that is, the controlled ablation of a thin surface layer resulting in the formation of a stable groove without the initiation of through-thickness cracking. The controlled scribing refers to the parametric domain of the process that ensures a reproducible groove depth and profile, with a minimal width of the heat-affected zone and a limited degree of localised damage. The present study focuses on identifying the range of processing parameters for CO 2 laser treatment of silicate glass within which a transition occurs from an uncontrolled network of ablation defects, re-melted areas, and edge chipping, to a controlled and well-defined microrelief. This transition is achieved without significant propagation of thermal effects or the accumulation of residual stresses, thereby enabling reproducible and predictable mechanical separation along the scribe line. The influence of laser power and beam scanning velocity on the degree of surface damage and associated morphological parameters was investigated. The specific linear energy input was employed as an integral control parameter, allowing the construction of a process window for the stable formation of grooves without the development of non-localised damage beyond the irradiated track. Laser scribing experiments were carried out using a technological system equipped with a CO 2 laser source based on a RECI W2 gas-discharge tube with a nominal output power of 100 W. The morphology of surface damage was examined by optical microscopy in both reflected and transmitted light. The linear dimensions, surface area, and nature of defects were determined using calibrated eyepiece micrometers and a stage micrometer. The results obtained make it possible to delineate the rational ranges of laser power and beam scanning velocity required for controlled micrometre-scale removal of the surface layer of silicate glass by the laser scribing method, ensuring the lowest attainable degree of damage. On this basis, a methodology has been proposed for the parametric selection of processing regimes, based on specific linear energy input and morphological indicators of damage, which is applicable to precision laser machining of brittle glassy and ceramic materials. VIII International Conference “In - service Damage of Materials: Diagnostics and Prediction“ (DMDP 2025) Influence of CO 2 Laser Processing Parameters on the Formation and Morphology of Surface Damage in Silicate Glass Valeriy Lazaryuk*, Ruslan Skliarov, Larysa Danylchenko, Volodymyr Shanaida Ternopil Ivan Puluj National Technical University, 56 Ruska str., Ternopil, 46001, Ukraine

* Corresponding author. Tel.: +38-035-251-9700 E-mail address: lazaryuk @ gmail . com

2452-3216 © 2026 The Authors. Copy from the contract: Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of DMDP 2025 organizers 10.1016/j.prostr.2026.03.090