PSI - Issue 80

Available online at www.sciencedirect.com Available online at www.sciencedirect.com Available online at www.sciencedirect.com

ScienceDirect

Procedia Structural Integrity 80 (2026) 352–367 Structural Integrity Procedia 00 (2023) 000–000 Structural Integrity Procedia 00 (2023) 000–000

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© 2025 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of Ferri Aliabadi © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http: // creativecommons.org / licenses / by-nc-nd / 4.0 / ) Peer-review under responsibility of Professor Ferri Aliabadi. Keywords: Field intensity factors; Electroelasticity; Half plate; Edge crack; Boundary integral equations; Body Force Method Abstract The electroelastic response of an edge crack emanating from a free straight boundary of a semi-infinite plate made of piezoelectric ceramics such as lead zirconate titanate (PZT) and barium titanium oxide (BaTio3) under far-field tension parallel to free edge is discussed when the poling axis is perpendicular to the free edge. The analysis is carried out based on the body force method which is an indirect boundary element method for general purpose stress analysis. The crack site is modeled by a continuously embedded body force and electric charge doublets in an infinite and a semi-infinite piezoelectric plate. The body force doublets compensate the relative displacement between the upper and the lower crack faces while the electric charge doublets are introduced to express the electric field between the upper and the lower crack faces. The crack tip stress and electric displacement intensity factor can be estimated accurately by defining a proper basic density function suitable for piezoelectric line crack problems. The determination of the basic density function for an electroelastic crack problem is stated in detail by introducing a classical technique based on complex variables and Lekhnitskii formalism. © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http: // creativecommons.org / licenses / by-nc-nd / 4.0 / ) Peer-review under responsibility of Professor Ferri Aliabadi. Keywords: Field intensity factors; Electroelasticity; Half plate; Edge crack; Boundary integral equations; Body Force Method Fracture, Damage and Structural Health Monitoring Electroelastic response of an edge crack in a piezoelectric half plate Akihide Saimoto a, ∗ , Yohei Sonobe a , Takuya Kitamura a , Atsuhiro Koyama a a Graduate School of Integrated Science and Technology, Nagasaki University, 1-14 Bunkyo-machi, Nagasaki 8528521, Japan Abstract The electroelastic response of an edge crack emanating from a free straight boundary of a semi-infinite plate made of piezoelectric ceramics such as lead zirconate titanate (PZT) and barium titanium oxide (BaTio3) under far-field tension parallel to free edge is discussed when the poling axis is perpendicular to the free edge. The analysis is carried out based on the body force method which is an indirect boundary element method for general purpose stress analysis. The crack site is modeled by a continuously embedded body force and electric charge doublets in an infinite and a semi-infinite piezoelectric plate. The body force doublets compensate the relative displacement between the upper and the lower crack faces while the electric charge doublets are introduced to express the electric field between the upper and the lower crack faces. The crack tip stress and electric displacement intensity factor can be estimated accurately by defining a proper basic density function suitable for piezoelectric line crack problems. The determination of the basic density function for an electroelastic crack problem is stated in detail by introducing a classical technique based on complex variables and Lekhnitskii formalism. Fracture, Damage and Structural Health Monitoring Electroelastic response of an edge crack in a piezoelectric half plate Akihide Saimoto a, ∗ , Yohei Sonobe a , Takuya Kitamura a , Atsuhiro Koyama a a Graduate School of Integrated Science and Technology, Nagasaki University, 1-14 Bunkyo-machi, Nagasaki 8528521, Japan Electronic devices with piezoelectric properties have a variety of engineering applications such as electromechani cal sensors, transducers, ultrasonic equipment, acoustic devices, actuators and wearable sensing systems for example Dai et al. (2023). Piezoelectric devices are also being considered for power generation devices because they can generate electricity from mechanical strain and vice versa. The use of piezoelectric materials as energy harvesters is summarized by Sezer and Koc (2021). It is known that the piezoelectric materials can be categorized into three groups as single crystal, ceramics and thin film types. Piezoelectric ceramic such as PZT and BaTio3 are manufactured as sintered ceramics, therefore, they are mostly brittle, and cracks that occur as a result of electrical or mechanical loading may propagate and lead to final fracture. Therefore, characterization of cracks in piezoelectric materials due to electrical and mechanical loading is highly important for the safe use and evaluation of the integrity of such materials. Electronic devices with piezoelectric properties have a variety of engineering applications such as electromechani cal sensors, transducers, ultrasonic equipment, acoustic devices, actuators and wearable sensing systems for example Dai et al. (2023). Piezoelectric devices are also being considered for power generation devices because they can generate electricity from mechanical strain and vice versa. The use of piezoelectric materials as energy harvesters is summarized by Sezer and Koc (2021). It is known that the piezoelectric materials can be categorized into three groups as single crystal, ceramics and thin film types. Piezoelectric ceramic such as PZT and BaTio3 are manufactured as sintered ceramics, therefore, they are mostly brittle, and cracks that occur as a result of electrical or mechanical loading may propagate and lead to final fracture. Therefore, characterization of cracks in piezoelectric materials due to electrical and mechanical loading is highly important for the safe use and evaluation of the integrity of such materials. 1. Introduction 1. Introduction

∗ Corresponding author. Tel.: + 81-95-819-2492 ; fax: + 81-95-819-2534. E-mail address: s-aki@nagasaki-u.ac.jp ∗ Corresponding author. Tel.: + 81-95-819-2492 ; fax: + 81-95-819-2534. E-mail address: s-aki@nagasaki-u.ac.jp

2452-3216 © 2025 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of Ferri Aliabadi 10.1016/j.prostr.2026.02.034 2210-7843 © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http: // creativecommons.org / licenses / by-nc-nd / 4.0 / ) Peer-review under responsibility of Professor Ferri Aliabadi. 2210-7843 © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http: // creativecommons.org / licenses / by-nc-nd / 4.0 / ) Peer-review under responsibility of Professor Ferri Aliabadi.

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