PSI - Issue 79

Giulia Morettini et al. / Procedia Structural Integrity 79 (2026) 440–448

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Fig. 7. (a) Example of first component placement and corresponding damage distribution; (b) updated PCB map showing exclusion zones after closed-loop iteration.

Conclusions The work presented has introduced an innovative and simplified numerical approach for evaluating the fatigue life of electronic components mounted on printed circuit boards, with particular focus on Through Hole devices, and specifically on radial-leaded components. The main objective was to develop a design-support tool capable of providing, during the early design stages, qualitative indications on the most suitable areas for component placement. Based on easily available physical and geometrical parameters and on the vibrational input expressed in terms of acceleration Power Spectral Density (PSD), the proposed method allows for the estimation, at each point of the board, of the total fatigue damage as the combination of the contributions due to PCB curvature and to the component’s dynamic response. The adoption of a low computational cost model, relying on preliminary Finite Element Method (FEM) analyses and on simplified beam-type relationships, makes this approach particularly suitable for integration into the early design phase, where speed and interpretability take precedence over absolute accuracy. Furthermore, the ability to operate in an iterative (closed-loop) mode enables progressive updating of the PCB damage map, accounting for the influence of components already mounted and allowing a more realistic and dynamic layout process. Although it does not replace experimental investigations or high-fidelity numerical models, the proposed tool represents a valuable decision-support instrument for electronic and mechanical designers, promoting a more integrated and efficient co-design process. Looking ahead, the extension of this method to more complex configurations and its calibration through experimental data will further enhance its reliability and broaden its potential applications. Al-Araji, Z., Swaikat, N., Turetsky, A., 2020. The perfect position of electrical components on PCBs in communication system industry from the mechanical aspects’ viewpoint. Journal of Mechanical Engineering Research and Developments, 43, 82–91. Aytekin, B., Ozguven, H.N., 2008. Vibration analysis of a simply supported PCB with a component – an analytical approach. In: 10th Electronics Packaging Technology Conference, 1178–1183. Béda, M.G., 2015. A curvature-based interpretation of the Steinberg criterion for fatigue life of electronic components. International Symposium on Microelectronics, 2015(1), 000707–000712. https://doi.org/10.4071/isom-2015-tha13 Bhavsar, N.R., Shinde, H.P., Bhat, M., 2014. Determination of mechanical properties of PCB. International Journal on Mechanical Engineering and Robotics, 2(4), 23–27. References