PSI - Issue 79

Available online at www.sciencedirect.com

ScienceDirect

Procedia Structural Integrity 79 (2026) 440–448

28th International Conference on Fracture and Structural Integrity - 3rd Mediterranean Conference on Fracture and Structural Integrity Development of a Random Fatigue Life Prediction Method for Electronic Components Mounted on PCBs Giulia Morettini a *, Filippo Cianetti a a University of Perugia, Department of Engineering, Via G. Duranti 93, 06125 Perugia, Italy Abstract In recent decades, the widespread use of electronic devices has increasingly highlighted the importance of reliability analysis for electronic components, particularly in critical applications such as the aerospace and automotive sectors. Among the main failure mechanisms, in addition to thermal loads, mechanical vibrations play a significant role, potentially leading to structural fatigue of components soldered on printed circuit boards (PCBs). This study aims to develop a simple yet effective numerical method for predicting the fatigue life of such components. The objective is to create a design support tool for electronic and mechanical engineers that, during the design phase, can identify the critical areas of a PCB for component placement, given the system inputs and assembly configuration. The graphical results demonstrate that once a specific component type is selected, the proposed tool can provide valuable guidance to designers for optimizing component placement on the board.

© 2025 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0)

Peer-review under responsibility of IGF28 - MedFract3 organizers Keywords: Type your keywords here, separated by semicolons ;

1. Introduction Assembled printed circuit boards (PCBa) represent the core of modern electronic systems, ranging from consumer devices to the most critical applications in the automotive, Horn (1991), and aerospace sectors, NASA (2002). The continuous miniaturization and functional integration of components have improved overall performance but, at the

* Corresponding author.. E-mail address: giulia.morettini@unipg.it

2452-3216 © 2025 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of IGF28 - MedFract3 organizers 10.1016/j.prostr.2025.12.355