PSI - Issue 71
Available online at www.sciencedirect.com
ScienceDirect
Procedia Structural Integrity 71 (2025) 111–117
5 th International Structural Integrity Conference & Exhibition (SICE 2024)
Effect of Temperature on High Cycle Fatigue Behaviour of Ti-6Al-4V Alloy T. Vivekananda Swamy* a , M. M. Thawre a , Atul Ramesh Ballal a , D. Chandru Fernando b , Akshay Mhaiske a , Sandeep Kale a , a Department of Metallurgical & Materials Engineering, Visvesvaraya National Institute of Technology Nagpur, 440010, India. b Materials Group, Gas Turbine Research Establishment, C V Raman Nagar, Bangalore,560093, India. Abstract Ti – 6Al – 4V alloy is widely used in aerospace applications for its high strength-to-weight ratio and outstanding resistance to corrosion. It also ensures better high temperature specific strength. Aerospace components are often confronted with cyclic stresses throughout their operating lives. The fatigue behaviour of Ti-6Al-4V alloy was studied at room temperature (RT) and moderately high temperature (150 ℃) at a stress ratio (R) of 0.7. The specimens were subjected to high cycle fatigue (HCF) loading at 78Hz on the RUMUL TESRONIC resonance system. Fractographic investigations were carried out on the tested specimens. HCF results indicate that, this alloy exhibited a decrease in fatigue strength by 50 MPa upon increasing the temperature from RT to 150 °C . The lower crack initiation resistance behaviour at increased temperatures provides a rationale for the decrease in fatigue strength. Findings from fractographic studies for RT tests reveal that the crack initiation region was observed to originate from the surface. Samples from specimens tested at 150 ℃ reveal that the cracks initiated from the interior. Keywords: Ti-6Al-4V; High Cycle Fatigue; Moderately High Temperature; Fractographs © 2025 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of SICE 2024 organizers
∗ Corresponding author. Tel.: +91-995-160-0660. E-mail address: vivekanandas479@gmail.com
2452-3216 © 2025 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of SICE 2024 organizers 10.1016/j.prostr.2025.08.016
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