PSI - Issue 68

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K. Sergiy et al. / Structural Integrity Procedia 00 (2025) 000–000

Kotrechko Sergiy et al. / Procedia Structural Integrity 68 (2025) 47–52

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Fig. 2. Dependence of the CGN strength on temperature.

Fig. 3. Contact bond break at temperatures lower than 1000 К.

Fig. 4. Step-by-step atomic rearrangements within the region near the contact bond during the CGN break at T=1100 K (see the text for explanation of the process details).