PSI - Issue 65

A.M. Kazakov et al. / Procedia Structural Integrity 65 (2024) 114–120 Kazakov A.M., Korznikova G.F., Korznikova E.A./ Structural Integrity Procedia 00 (2024) 000–000

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compatibility between the surface-treated graphene and copper. Figure 2 shows the preparation process and composite microstructure.

Fig. 1. Copper-graphene composite thermal conductivity depending on graphene volume fraction (Chu et al., 2018).

Fig. 2. (a) Schematic diagram of graphene paper surface treatment process, (b) Schematic diagram of preparation of cast copper powder film, (c) Zebra skin structure and composite microstructure (Liu et al., 2021).