PSI - Issue 65

Available online at www.sciencedirect.com Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2024) 000–000 Available online at www.sciencedirect.com ScienceDirect Structural Integrity Procedia 00 (2024) 000–000

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ScienceDirect

Procedia Structural Integrity 65 (2024) 114–120

The 17th International Conference on MECHANICS, RESOURCE AND DIAGNOSTICS OF MATERIALS AND STRUCTURES (MRDMS 2023) Recent advances in copper-graphene composites: Enhancing thermal conductivity through material engineering A.M. Kazakov a,b , G.F. Korznikova b , A.S. Semenov c , E.A. Korznikova a,b,c, * a Youth Research Laboratory “Metals and Alloys under Extreme Impacts”, Ufa University of Science and Technology, 450076 Ufa, Russia b Institute of Metal Superplasticity Problems, Russian Academy of Sciences, 450001 Ufa, Russia c Polytechnic Institute (branch) in Mirny, M.K. Ammosov North-Eastern Federal University, 678179 Mirny, Russia Abstract Copper-graphene composites have gained significant attention due to their remarkable thermal conductivity and mechanical properties, making them ideal for advanced heat management applications. This review focuses on the recent developments in copper-graphene composite structures, exploring key factors that influence their thermal conductivity, such as graphene content, interfacial bonding, and fabrication methods. By employing techniques like ball milling, spark plasma sintering, and chemical vapor deposition, researchers have enhanced the thermal and mechanical performance of these composites. The review also highlights the challenges in optimizing graphene dispersion and interfacial bonding, providing insights into future developments for thermal management systems in electronics and other industries. © 2024 Kazakov A.M., Korznikova G.F., Semenov A.S., Korznikova E.A., Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of MRDMS 2023 organizers Keywords: copper-graphene composite; thermal conductivity; interfacial bonding; fabrication method The 17th International Conference on MECHANICS, RESOURCE AND DIAGNOSTICS OF MATERIALS AND STRUCTURES (MRDMS 2023) Recent advances in copper-graphene composites: Enhancing thermal conductivity through material engineering A.M. Kazakov a,b , G.F. Korznikova b , A.S. Semenov c , E.A. Korznikova a,b,c, * a Youth Research Laboratory “Metals and Alloys under Extreme Impacts”, Ufa University of Science and Technology, 450076 Ufa, Russia b Institute of Metal Superplasticity Problems, Russian Academy of Sciences, 450001 Ufa, Russia c Polytechnic Institute (branch) in Mirny, M.K. Ammosov North-Eastern Federal University, 678179 Mirny, Russia Abstract Copper-graphene composites have gained significant attention due to their remarkable thermal conductivity and mechanical properties, making them ideal for advanced heat management applications. This review focuses on the recent developments in copper-graphene composite structures, exploring key factors that influence their thermal conductivity, such as graphene content, interfacial bonding, and fabrication methods. By employing techniques like ball milling, spark plasma sintering, and chemical vapor deposition, researchers have enhanced the thermal and mechanical performance of these composites. The review also highlights the challenges in optimizing graphene dispersion and interfacial bonding, providing insights into future developments for thermal management systems in electronics and other industries. © 2024 Kazakov A.M., Korznikova G.F., Semenov A.S., Korznikova E.A., Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of MRDMS 2023 organizers Keywords: copper-graphene composite; thermal conductivity; interfacial bonding; fabrication method © 2024 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of MRDMS 2023 organizers Copper-graphene composites have garnered significant attention for their exceptional thermal properties, particularly in applications where efficient heat management is critical. The integration of graphene, a material known for its unparalleled thermal conductivity and other unique properties, Wejrzanowski et al. (2016), Korznikova et al. (2019), Babicheva et al. (2020), with copper matrices has opened up avenues for enhancing the thermal performance of conventional copper, Wu et al. (2019). Copper-graphene composites have garnered significant attention for their exceptional thermal properties, particularly in applications where efficient heat management is critical. The integration of graphene, a material known for its unparalleled thermal conductivity and other unique properties, Wejrzanowski et al. (2016), Korznikova et al. (2019), Babicheva et al. (2020), with copper matrices has opened up avenues for enhancing the thermal performance of conventional copper, Wu et al. (2019). 1. Introduction 1. Introduction

* Corresponding author. Tel.: +7-919-602-2704. E-mail address: elena.a.korznikova@gmail.com * Corresponding author. Tel.: +7-919-602-2704. E-mail address: elena.a.korznikova@gmail.com

2452-3216 © 2024 The Authors, Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of MRDMS 2023 organizers 2452-3216 © 2024 The Authors, Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of MRDMS 2023 organizers

2452-3216 © 2024 The Authors. Published by ELSEVIER B.V. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0) Peer-review under responsibility of MRDMS 2023 organizers 10.1016/j.prostr.2024.11.018