Issue 55

D.-h. Zhang et alii, Frattura ed Integrità Strutturale, 55 (2021) 316-326; DOI: 10.3221/IGF-ESIS.55.24

are shown in Tabs. 1-2. The symmetric constraints were applied in the x and y directions, and the z direction nodal displacement was restricted at the bottom surface of the model. The cyclic temperature was loaded at the exterior surface of the power module.

Coefficient of

Coefficient of

Specific

Temperature ℃

Elastic

Poisson’s

Density

Yield

thermal expansion

heat transfer

Heat

kg/m 3

modulus/ GPa

ratio

strength

10 -6 /K

W/(m.K)

J/(kg.K)

57.568

-75

54.311

9.8

41.253

-25

48.392

15.9

29.00

25

42.892

21.5

0.35

57

217

7390

20.82

75

37.811

22

16.98

125

33.148

22.7

16.64

175

28.903

23.6

Table 2: Thermomechanical property of Sn3Ag0.5Cu.

T hot =175℃

10℃/min

T cold =-55℃

Figure 2: Cyclic temperatures in thermal fatigue

SiC IGBT

Silica gel

Chip Solder(TIM1)

Cu

Base plate Solder(TIM2)

Cu

Cu

Figure 3: The 1/4 FE model

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