Issue 21

A. Yu Fedorova et alii, Frattura ed Integrità Strutturale, 21 (2012) 46-53; DOI: 10.3221/IGF-ESIS.21.06





 ,

x y T k k - direct Fourier transform of the temperature.

The initial temperature distribution and temperature distribution obtained using equation (4) are shown in Fig. 3. Finally, an infrared image of the temperature increment on the specimen surface during crack propagation is shown in Fig. 4 after all stages of signal processing.

a) b) Figure 3 : The temperature field before (a) and after (b) data processing.

Figure 4 : The temperature field after all stages of signal processing.

D ETERMINATION OF THE HEAT DISSIPATED AT THE CRACK TIP CAUSED BY PLASTIC DEFORMATION

            T s c T k T , where T – temperature, ρ – density (4505 kg/m 3 ), c – heat capacity (540 J/(kg·K)), k – heat conductivity (18.85 W/(m·K)), T 

he value of the specific heat power at the crack tip can be determined using the following relation [10]

(5)

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