Issue 15

P. F

. Fuchs et alii, F

rattura ed Integ

rità Strutturale,

15 (2011) 64-7

3; DOI: 10.3221

/IGF-ESIS.15.07

stat goo Fin 

istical evalua d approach ally, the follo The BLCBT times depen BLDT. In differences i The BLCBT by default. I testing spac impact ener The BLCBT displacemen The BLCBT Simulations challenging acceleration future analy erefore, BLC ulations are p us, having th ure stress ov diction of th

tion based o of the two m wing advant testing time ds on the bo our case the s an approxim can be perf n contrast th e. Furthermo gy, an adjustm can be perf t and frequen can be si of the BLD [14, 16]. The signal is app sis it is plan BT will be p lanned. e local failure er the numb e PCB fatigu

n a two-para ethods. ages of the B is significan ard perform BLCBT w ate break o ormed consi e BLDT und re, in the BL ent to prede ormed on b cy. mulated at T are difficu simplest wa lied directly t ned to gene erformed at stresses in d er of cycles. T e behaviour.

meter Weibu LCBT over t tly shorter th ances. The b as about two f 5 seconds b dering differ er temperatu DT only the fined amplit asically every lower compu lt, as the lo y to simulate o the board, rate Wöhler different def ependence o his resulting

ll distributio he BLDT co an the BLD etter a boar times faste etween each ent influence re influence i initial ampli udes is difficu dynamic tes ting times ad applicatio the BLDT i which is still curves [22] lection levels f the PCB be Wöhler cur

n was perfor uld be identif T testing tim d performs, r than the drop in the B parameters s costly, as th tude can be c lt. The frequ ting machine than the BL n and the d s the ‘Input computation to evaluate . To determi nding amplit ves should h

med. The st ied: e (The facto the faster is BLDT. The LDT.) (e.g. tempera e temperatur ontrolled. A ency in BLD which is ca DT using t efinition of G method’ [ ally expensiv the fatigue ne the acting udes, it woul elp to impro

atistical resul

ts supported

the

r between th the BLCBT reason for ture, frequen e has to be a s this is done T can hardly pable of app he Finite E the boundar 13, 17, 18, 2 e. behaviour o local stresse d be possible ve the under

e method tes compared to the testing t cy or amplitu pplied on a l by adapting be varied at lying the des lement Meth y conditions 0, 21]), where f PCB desi s, finite elem to plot the l standing and

ting the ime de) arge the all. ired od. are an gns. ent ocal the







In Th sim Th fail pre

A C

KNOWLEDG

EMENTS

and the T

f this paper framework tributions by & Systemtec yria and Upp

he resea Austria) Technol

rch work o within the ogy with con Technologie nments of St

was perform of the Kplu the Institut hnik Aktieng er Austria.

ed at the P s-program o e of Material esellschaft. T

olymer Com f the Austr Science and he PCCL is

petence Cen ian Ministry Testing of P funded by t

ter Leoben of Traffic, lastics, Univ he Austrian G

GmbH (PC Innovation ersity of Leo overnment

CL, and ben and

the Austria State Gover

R E

FERENCES

[1] [2] [3] [4] [5] [6] [7] [8] [9] [10 [11 [12 [13

E. H. Wong JEDEC Sta (2003). E. H. Wong 139. J. Luan, T. Y S. K. W. Sh technology E. H. Wong Leoni, Y. –S J. L. Rodger X. Qu, Z. C G. Heaslip, ] D. Y. R. Ch ] P. L. Tu, Y. ] W. H. Zhu Component ] O. Beucher

, S. K. W. Se ndard JESD2 , S. K. W. Se . Tee, E. Pe ea, E. H. W conference, ( , S. K. W. Se . Lai, C. –L. s, W. A. Nic hen, B. Qi, T J. M. Punch, ong, H. J. To C. Chan, K. , J. H. L. Pa s and Techn , Wahrschein

ah, V. P. W. 2-B111, Boa ah, W. D. va k, C. T. Lim, ong, Y.-W. 2006) 1003– ah, C. S. Selv YEH, J. Ele ewander, The . Lee, J. Wan Electronic a h, B. K. Lim C. Hung, J. K ng, X. R. Zh ology Confer lichkeitsrech

Shim, Micro rd Level Dro n Driel, J. F. Z. Zhong, M Mai, R . Raj 8 anayagam, R ctron. Mater American S g, Microelec nd Photonic , P. T. H. Lo . L. Lai, Mic ang, E. Poh ence, (2008) nung und Sta

electron Relia p Test Meth J. M. Caers, icroelectron oo, C. T. Lim . Rajoo, W. ., 38 (2009) 8 tatistician, 42 tron Reliab., Packaging, 3 w, In: Electr roelectron R , Y. F. Sun, 1667. tistik mit Ma

b., 48 (2008) od of Comp N. Owens, Y Reliab., 47 (2 , In: Procee D. Driel, J. F 84. (1) (1988) 59 47 (2007) 21 (2003) 125. onics Packagi eliab., 41 (20 A. Y. S. Sun tlab. Springer

1747. onents for H . –S. Lai, Mi 007) 450. dings of 56 t . J. M. Caers . 97. ng Technolo 01) 287. , C. K. Wan , Berlin Heid

andheld Elec croelectron R

tronic Produ eliab., 49 (20

cts, 09)

h electronic , X. J. Zhao,

components N. Owens, L

and . C.

gy Conferen g, H. B. Ta elberg, (2005

ce, (2005) 26 n, In: Electro ).

2.

nic

72