Issue 15

P. F

. Fuchs et alii, F

rattura ed Integ

rità Strutturale,

15 (2011) 64-7

3; DOI: 10.3221

/IGF-ESIS.15.07

C pr

yclic be inted c

nd test ircuit b

s for the oards u

reliab nder dy

ility eva namic

luation loads

of

P.F Poly

.Fuchs mer Compete Major titute of Polym STRACT . T ctronic prod ferent tests s test, the b ure driver is wbacks, an results of porting the e advantage lower comp local stress YWORDS . P

nce Center L

eoben GmbH,

Roseggerstras

se 12, 8700

Leoben, Aust

ria

Z. Ins

er Product E

ngineering, Joh

annes Kepler

University, A

ltenbergerstra

sse 69, 4040

Linz, Austri a

he reliabilit ucts indust were develo oards are d a flexural o alternative both tests w suitability o s of the alte uting time. es. rinted Circu ormance of g market fo s are especial n result in se p performan he developm ed under the ed until failu e standardiz ucibility, the ance. ork an altern e to input a test (BLCB N

y of printe ry. In orde ped. The cu ropped und scillation o test method ere compa f the board rnative test In future an

d circuit bo r to predict rrent indus er defined f the board was evalua red. A very level cyclic method wer alysis, test

ards under the perform try-wide sta conditions due to the i ted in this s good corr bend test fo e shorter te simulations

dynamic l ance of th ndard testin until a failu mpact even tudy. A boa elation betw r the determ sting times, will be used

oads is a k e boards in g method is re in the bo t. As this te rd level cyc een the m ination of better adap to generat

ey issue in their appli a board lev ard is dete st method h lic bend tes ethods coul the drop tes tability and e Wöhler cu

the handh cation lifeti el drop test cted. The m as a numbe t was used d be observ t performan test simulati rves related

eld me, . In ain r of and ed, ce. ons to

A B ele dif thi fail dra the sup Th at the

it Board; Re

liability; Dr

op Test; Cy

clic Bend T

est; Fatigue.

K E

I N

TRODUCTIO

imp eva et a B1 PC Dr the imp Th circ lev T

he perf increasin product

printed circu r handheld e ly prone to b rious damag ce and to dev ent of the m Joint Electro re is detected ed BLDT ar main criticis ative test to cceleration c T), applying

it boards (P lectronic pr e dropped, i e of the PCB elop reliable ethods in the nic Device E . The rather e discussed in ms are the s determine th reated from a repeated an

CBs) under oducts. Beca .e. exposed t interconnec designs, diff ir work [1]. A ngineering complex tes literature e. low test thro e drop perfo dropping, is d well define

dynamic lo use of their o an impact tions and th erent board standardize Council (JED t set-up and g. by Wong ughput and rmance was the primary d d flexure, wa

ads is of sig size and app load during t us in the ma level test met d board leve EC) [2]. In load applicat et. al [1, 3] an the lack of r performed a river for PC s used to rep

nificant inte lication, han heir useful se lfunction of hods were in l drop test (B this test defin ion affect the d Luan et. a elevance to t nd evaluated B failure. Th roduce the l

rest due to dheld electro rvice life. Th the product. troduced. W LDT) JESD ed drops of test robustn l [4]. Apart f he product d . Flexing of erefore, a bo oading situat

the nic ese To ong 22- the ess. rom rop the ard ion.

act loads ca luate the dro l. reviewed t 11 was defin Bs are repeat awbacks of th poor reprod act perform us, in this w uit board, du el cyclic bend

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